Special solders determined for the application to optical products and for accurate case sealing. They are based on alloys mainly of gold, silver, tin, indium and bismuth and many eutectic solders. A soldering range from 11°C up to 365°C can be covered. In cooperation with our partner AIM Products LLC (USA), we offer specific molds according to your specifications.
Photonic Packing solders
The selection of special material connections by AIM comprises indium-tin and golden-tin solders for Photonic Packing. Working with AIM products will provide you with premium products and high-class support. This will enable you to manufacture innovative and high-quality photonic packing products. We offer a wide range of solders to fulfill your most demanding Component Packaging application.
- Fiber to Ferrule Soldering
- Laser Die Attach
- Hermetic Packaging & Sealing
- Wetting & Sealing Laser Optics
- Thermal Management
Photonic Packing solder alloys contain:
- Gallium-based solder alloys
The most common photonic packing solder alloys are as follows:
|Alloy Composition||Melting Range [°C]||Tensile Strength [ksi]||Density (g/cm³)||CTE [x10-8/°C]||Creep Resistance|