AIMSolderPreformsDSpecial solders determined for the application to optical products and for accurate case sealing. They are based on alloys mainly of gold, silver, tin, indium and bismuth and many eutectic solders. A soldering range from 11°C up to 365°C can be covered. In cooperation with our partner AIM Products LLC (USA), we offer specific molds according to your specifications.

 

Photonic Packing solders

PhotonikPackagingExampleThe selection of special material connections by AIM comprises indium-tin and golden-tin solders for Photonic Packing. Working with AIM products will provide you with premium products and high-class support. This will enable you to manufacture innovative and high-quality photonic packing products. We offer a wide range of solders to fulfill your most demanding Component Packaging application.

 

Solders:

  • Fiber to Ferrule Soldering
  • Laser Die Attach
  • Hermetic Packaging & Sealing
  • Wetting & Sealing Laser Optics
  • Thermal Management

Photonic Packing solder alloys contain:

  • Indium
  • Gold
  • Wismut
  • Cadmium
  • Gallium-based solder alloys

The most common photonic packing solder alloys are as follows:

Alloy Composition Melting Range [°C]  Tensile Strength [ksi]  Density (g/cm³)  CTE [x10-8/°C]  Creep Resistance 
80Au/20Sn 280 276 14.5 16 Excellent
88Au/12Ge 356 185 14.7 13 Excellent
96.5Sn/3.5Ag 221 38 7.36 21 High
95Sn/3.5Ag/1.5In 218 51 7.36 22 High
91Sn/9Zn 199 65 7.27 n/a Good
63Sn/Pb36/Ag2 179 46 8.41 27 High
CASTIN 217 40 7.30 40

High

SAC305 218 40 7.40 40 High
40In/60Pb 195-225 34.5 9.31 26 Moderate
70In/30Pb 160-174 23.8 8.19 28 Moderate
80In/Pb15/Ag5 148-149 17.5 7.85 26 Moderate
100In 156.7 2.5 7.31 29 Poor
97In/3Ag 146 5.5 7.38 22 Poor
52In/48Sn 118 11.9 7.30 24 Low
58Bi/42Sn 138 55 8.56 14 Moderate
40Bi/60Sn 138-170 n/a 8.12 14 Moderate
54Sn/26Pb/20In 138-150 n/a 8.10 25 Moderate
35.7Sn/35.7Pb/28.6Bi  100 24 9.34 20 Low

 

 AIMLogoWorld

 >> Download brochure on AIM